Introducing the Sentrex Product Line:
(PDF Data Sheets may be downloaded by clicking on icon)
Provides fast and clean release during multi-layer lamination and protects copper foil from pits and dents.
Provides pressure equalization and uniform heat diffusion during multi-layer lamination.
Provides fast and clean release during CCL lamination.
Provides fast and clean release during flexible and rigid-flexible lamination.
The first standard method for laminating flexible and rigid-flexible circuits.